The Electronic Packaging Handbook

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Glenn R. Blackwell (Purdue University, West Lafayette, Indiana, USA) Jerry C. Whitaker (Technical Press, Morgan Hill, California, USA)

The Electronic Packaging Handbook

Glenn R. Blackwell (Purdue University, West Lafayette, Indiana, USA), Jerry C. Whitaker (Technical Press, Morgan Hill, California, USA), Richard C. Dorf (University of California, Davis, USA) , Victor Meeldijk (Intel Corp., Parsippany, New Jersey, USA)

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English

CRC Press Inc
29 November 1999

Printing, packaging & reprographic industry; Engineering: general; Technical design; Electrical engineering; Electronics engineering

Series: Electronics Handbook Series

The packaging of electronic devices and systems

represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and

safety.

Electronics packaging continues to include expanding

and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Contributions by: Victor Meeldijk (Intel Corp. Parsippany New Jersey USA)
Edited by: Glenn R. Blackwell (Purdue University West Lafayette Indiana USA)
Series edited by: Jerry C. Whitaker (Technical Press Morgan Hill California USA), Richard C. Dorf (University of California, Davis, USA), Richard C. Dorf (University of California, Davis, USA)
Imprint: CRC Press Inc
Country of Publication: United States
Volume: 4
Dimensions: Height: 254mm, Width: 178mm, Spine: 40mm
Weight: 1.270kg
ISBN: 9780849385919
ISBN 10: 0849385911
Series: Electronics Handbook Series
Pages: 638
Publication Date: 29 November 1999
Audience: Professional and scholarly , Professional and scholarly , Undergraduate , Undergraduate
Format: Hardback
Publisher's Status: Active

Fundamentals of the Design Process. Surface Mount Technology. Integrated Circuit Packages. Direct Chip Attach. Circuit Boards. EMC and PCB Design. Hybrid Assemblies. Interconnects. Design for Test. Adhesive and Its Application. Thermal Management. Testing. Inspection. Package/Enclosure. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach. Product Safety and Third-Party Certification. Appendix A: Definitions. Index.

Glenn R. Blackwell

Reviews for The Electronic Packaging Handbook

...highly recommended...enough detail...provides essential factural information on the design, manufacturing, and testing of electronic devices and systems...this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products...The book ties together well with references between chapters...well written and edited...each chapter includes a section of bibliographic references and suggested readings. --Dave Fish, Pandion Electronics, Inc., SMTnet.com