Within this work electrochemical processes for manufacturing of novel silicon solar cells are investigated. Direct plating of Ni and Al on n- and p-silicon is demonstrated by making use of solar cell characteristics. Homogenous Ni/Cu stacks are realized for bifacial and back contact solar cells, forming an excellent mechanical and electrical contact to silicon. For metallization of HIT solar cells, the plating behavior on ITO layers is studied. Additionally, plating processes on evaporated Al layers are developed and applied to back contact solar cells. By means of process optimization the plated metal stack on Al features sufficient adhesion and increases the lateral conductivity of the metal grid resulting in increased solar cell efficiency. An advanced metallization route for back contact solar cells which purposefully utilizes the different characteristics of the deposited metals (Al, Ni, Cu) is developed. The resulting metal stacks are characterized in detail using SEM, EDX and AES methods. Besides plating processes, local oxidizing processes for Al are established and combined with printing technologies to realize the metal contact separation for back contact solar cells.
By:
Mathias Kamp Edited by:
Fraunhofer ISE Freiburg Imprint: Fraunhofer Verlag Country of Publication: Germany Dimensions:
Height: 210mm,
Width: 148mm,
Spine: 10mm
Weight: 236g ISBN:9783839610558 ISBN 10: 3839610559 Series:Solare Energie- Und Systemforschung Pages: 193 Publication Date:06 October 2016 Audience:
Professional and scholarly
,
Undergraduate
Format:Paperback Publisher's Status: Active